The new Chair of IEC TC 91: Electronics assembly technology, Dr Udo Welzel, has a strong scientific background.
After completing a PhD in chemistry at the University of Stuttgart in Germany in 2002, he joined the Max Planck Institute for Metals Research where he headed the central scientific facility on X-ray diffraction. At the same time he started a collaboration programme with the Bosch Group on lead-free soldering. In 2012, he joined Bosch inside the Department of Automotive Electronics – Assembly and Interconnect Technology.
He is a team leader of the group dedicated to high-performance logic electronic control units. He is also responsible for standardization related to assembly and interconnect technology inside the company.
His standardization activities take place both on a national and international level. He is a Vice-Chair of the German National Committee (DKE). He is also a member of Working Groups (WG) 1, 3 and 10 of IEC TC 91. In 2014, he was awarded the IEC 1906 award, which recognizes exceptional current achievements of experts.