Information and communications technologies are key to digital transformation. Yet, given their fast-paced evolution and widespread impact, it can be a challenge for standardization organizations to fully address these technologies and allow for their full integration and interoperability.
To help face these challenges and fully embrace the complexities of communication technologies and architectures, the IEC has set up a new systems group, SyC COMM, with the aim of providing a holistic approach to their standardization.
SyC COMM will provide guidance and harmonization in the area of communication technologies and architectures as they relate to the activities of the IEC. It will closely collaborate with IEC technical committees to support their ongoing work in communication technologies and facilitate the outreach with other standards development organizations and industry consortia involved in this area.
IEC members recently appointed Yun Chao Hu as the new Chair of SyC COMM. Mr. Hu is a veteran standardization strategist with over 18 year of experience in ICT. He currently serves as senior director of strategy marketing at Huawei Technologies in Germany. Within the IEC, Mr. Hu has contributed actively towards the work of the Market Strategy Board (MSB), SyC SM (smart manufacturing, TC 65 as well as the Convenor for SEG 8 Working Group 1 (market and technology trends and SyC SM Advisory Group 1 (marketing, outreach and communications).
As noted by Mr. Hu, “We have many challenges ahead as we consider the impact of information communication technologies and architectures on standardization, monitor key trends such as the convergence of OT and IT and collaborate with IEC technical committees and other organizations. I am very excited to lead the work of SyC COMM and look forward to working with a great team of experts from around the world.”
Mr. Hu will be seconded by Patrick Wetterwald who will serve as Vice-Chair. Mr. Wetterwald is a senior manager at Cisco responsible for standardization, alliances and innovation in the areas of IoT architecture and telecommunication technologies. Within the IEC, Mr. Wetterwald served as the convenor of SEG 8 (communication technologies and architectures) and an active contributor to TC57 and TC 65.